Edge AI chiplet uses SemiDynamics RISC-V cores
By Nick Flaherty, eeNews Europe (January 19, 2024)
YorChip is developing a chiplet for edge AI applications using RISC-V cores from Semidynamics in Barcelona.
The edge AI chiplet will use the SemiDynamics Atrevido quad core RISC-V IP and the UCIe standard interface. The four Atrevido 423 cores provide 10 Int8-TOPS per chiplet in a target technology of 12nm and a target die size under 25mm2.
SemiDynamics in Barcelona has developed series of configurable RISC-V vector processors for automotive, robotic, drones and other high-performance edge AI markets. YorChip is a Silicon Valley start-up aiming to developing a complete ecosystem of off the shelf focused on chiplets using proven partner IP and a novel die-to-die technology.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona
- EdgeCortix Awarded New 3 Billion Yen NEDO Project to Develop Advanced Energy-Efficient AI Chiplet for Edge Inference and Learning
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- EDGE and Lockheed Martin to Collaborate on Advanced Chiplet Design Capabilities
Latest News
- Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
- Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
- Arm Positions Neoverse for AI and Telco Networks at MWC
- NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily
- CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects