Development Flows For Chiplets
A chiplet economy requires standards, organization, and tools — and that’s a problem.
By Brian Bailey, Semi Engineering | May 15, 2025
Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has to come together before that becomes reality. It takes an ecosystem, which is currently very rudimentary.
Today, many companies have hit the reticle limit and are forced to move to multi-die solutions, but that does not create a plug-and-play chiplet market. These early systems do not need to adhere to standards to make them work, and they do not seek the same benefits. From a design perspective, they are still constructing one large system.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
- Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
- What could back an open market for chiplets?
- Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
Latest News
- Quantum Computing Inc. Completes Acquisition of NHanced Semiconductors, Inc.
- GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
- Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
- NHanced Semiconductors President Robert Patti to Deliver Plenary Presentation on the Critical Role of Advanced Packaging at the 2026 Lithography Workshop
- Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing