Development Flows For Chiplets
A chiplet economy requires standards, organization, and tools — and that’s a problem.
By Brian Bailey, Semi Engineering | May 15, 2025
Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has to come together before that becomes reality. It takes an ecosystem, which is currently very rudimentary.
Today, many companies have hit the reticle limit and are forced to move to multi-die solutions, but that does not create a plug-and-play chiplet market. These early systems do not need to adhere to standards to make them work, and they do not seek the same benefits. From a design perspective, they are still constructing one large system.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- What could back an open market for chiplets?
- Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
- ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development
- EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
Latest News
- Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
- Multibeam Appoints Interim CFO Following $200M Funding Milestone
- Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
- Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging