Cyber Threats Multiply With Commercial Chiplets
Opening the door to third-party chiplet makers requires new approaches, greater diligence, and a deeper focus on security.
By Ann Mutschler, Semi Engineering | May 1, 2025
The commercialization of chiplets will significantly boost the potential for attacks on hardware, requiring a much broader set of security measures and processes at every level of the supply chain, including traceability from initial design to end of life.
Much progress has been made in recent years on security measures, including everything from identifying unusual data traffic inside a chip to complex obfuscation techniques. But chiplets multiply the number of possible attack vectors, and the more chiplets in a design the harder it is to protect a device. There is more data being processed, moved, and stored, and more components are involved in making that happen.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Proprietary Vs. Commercial Chiplets
- Security Is Critical For Commercial Chiplets
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- Chiplets Still A Challenge With UCIe 2.0
Latest News
- Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
- CoAsia SEMI Unveils Advanced Strategy for Next-Generation Chiplet Platform 'CoCs™' at Samsung SAFE Forum
- JCET Launches Next-Generation Power Module Packaging and Test Solutions for AI Data Centers
- As Chips Go Vertical, Metrology Struggles to Keep Up
- Silicon Box Secures SGD 100M Financing to Accelerate Growth in Advanced Packaging