Why China is betting big on chiplets
By Zeyi Yang, MIT Technology Review
February 6, 2024
By connecting several less-advanced chips into one, Chinese companies could circumvent the sanctions set by the US government.
For the past couple of years, US sanctions have had the Chinese semiconductor industry locked in a stranglehold. While Chinese companies can still manufacture chips for today’s uses, they are not allowed to import certain chipmaking technologies, making it almost impossible for them to produce more advanced products.
There is a workaround, however. A relatively new technology known as chiplets is now offering China a way to circumvent these export bans, build a degree of self-reliance, and keep pace with other countries, particularly the US.
In the past year, both the Chinese government and venture capitalists have been focused on propping up the domestic chiplet industry. Academic researchers are being incentivized to solve the cutting-edge issues involved in chiplet manufacturing, while some chiplet startups, like Polar Bear Tech, have already produced their first products.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- China forms its own chiplet standard amid isolation
- With “Big Chip,” China Lays Out Aspirations For Waferscale
- China researchers report 256 core, chiplet-based processor
- US-Made ‘Chiplet’ Tech Emerges as Core China Chip Strategy
Latest News
- Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
- ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan
- SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
- AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
- Hamamatsu Photonics develops inverted emission microscope "iPHEMOS®-DDX" for failure analysis of advanced semiconductor packages