China forms its own chiplet standard amid isolation
By Peter Clarke, eeNews Analog (March 27, 2023)

The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association Press.
The standard defines a high-speed serial port and is focused on optimization based on the domestic packaging and substrate supply chain, with cost and commercial practicality as a key consideration, the report said. The standard was developed by the Cross Information Core Technology Research Institute working with the China Chiplet Industry Alliance, which includes domestic system, IP, and packaging manufacturers.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Keysight Expands Chiplet Interconnect Standards Support in Chiplet PHY Designer 2025
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs