China forms its own chiplet standard amid isolation
By Peter Clarke, eeNews Analog (March 27, 2023)

The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association Press.
The standard defines a high-speed serial port and is focused on optimization based on the domestic packaging and substrate supply chain, with cost and commercial practicality as a key consideration, the report said. The standard was developed by the Cross Information Core Technology Research Institute working with the China Chiplet Industry Alliance, which includes domestic system, IP, and packaging manufacturers.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
Latest News
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026
- Qualcomm Completes Acquisition of Alphawave Semi