Can You Build A Known-Good Multi-Die System?

Executive Outlook: Just because the various components in an advanced package work individually and separately doesn’t mean they will work post-assembly.

 By Ed Sperling, Semiconductor Engineering

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product management at Synopsys. What follows are excerpts of that discussion, which was held in front of a live audience at ESD Alliance 2025.

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