Advanced Chip Packaging Tools Are New Battleground in India
By Yashasvini Razdan, EETimes | September 16, 2025
Advanced packaging has become the new battleground in semiconductors. As the industry shifts focus from pursuing smaller transistors to achieving system-level integration, the assembly of bare chips into functional devices becomes crucial.
At SEMICON India 2025, announcements such as the Tata Electronics–Merck MoU for materials and infrastructure, and the Kaynes–Infineon MoU to package Infineon bare die and explore advanced package and MEMS microphone manufacturing in India showed that the country has recognized that packaging is no longer a low-value, outsourced step.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- JCET’s Automotive Chip Advanced Packaging Flagship Factory Project Gains Momentum
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Materials for Leading-Edge Chip Production
Latest News
- Baya Systems Expands Bengaluru Engineering Hub to Scale AI, Automotive and HPC Innovation
- NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics (NPO) Chiplet Solution with Interoperability for 1.6T
- CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet