Advanced Chip Packaging Tools Are New Battleground in India
By Yashasvini Razdan, EETimes | September 16, 2025
Advanced packaging has become the new battleground in semiconductors. As the industry shifts focus from pursuing smaller transistors to achieving system-level integration, the assembly of bare chips into functional devices becomes crucial.
At SEMICON India 2025, announcements such as the Tata Electronics–Merck MoU for materials and infrastructure, and the Kaynes–Infineon MoU to package Infineon bare die and explore advanced package and MEMS microphone manufacturing in India showed that the country has recognized that packaging is no longer a low-value, outsourced step.
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