A sneak peek at chiplet standards

By Majeed Ahmad, EDN (September 4, 2023)

The scaling of system-on-chip (SoC) architectures is hitting the wall, paving the way for die-to-die interconnect in heterogenous single-package systems commonly known as chiplets. But while these chiplet-optimized interconnect technologies are gaining significant traction, they are still in their infancy.

That makes chiplet interconnect standards crucial for the new multi-die semiconductors era. Below is a brief outline of three standards that are considered critical in the present evolution of chiplets. These standards will likely play a vital role in creating an open chiplet ecosystem.

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