Thermal Advances Driving Next-Gen AI Chip Design
AI is hot — literally.
As AI computing requires higher, unprecedented power levels, thermal management emerges as a critical bottleneck for reliable system performance. And the necessary shift to 3D chip architectures only “increases the temperature.” Stacking heterogenous dies in a compact space leads to higher power densities, creates intense localized hot spots, and traps heat far away from cooling heat sinks. This is not merely an analogy but a demonstrable engineering constraint that defines the boundaries of viable designs today.
If you’re wondering just how extreme it gets: power densities in leading-edge 3D ICs have already been compared to the surface of the sun. That’s the uncomfortably “hot” reality every AI hardware designer now must confront, and it’s likely to get hotter if we don’t turn down the heat.
Fortunately, new advances in materials, packaging, AI, and multiphysics simulations may help. To that end, we’ve identified five thermal trends that we believe can reshape your design and packaging workflows so you can keep it cool.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Blogs
- The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
- UCIe for 1.6T Interconnects in Next-Gen I/O Chiplets for AI data centers
- From Spec to Silicon: Successful Physical AI System Chiplet Bring-Up
- Arm Zena CSS – Accelerating Chiplet-Based SoC Design for AI-Defined Vehicles
Latest Blogs
- Thermal Advances Driving Next-Gen AI Chip Design
- Designing the Future: How 3DIC Compiler Is Powering Breakthroughs Across the MultiDie Design Landscape
- Building out the Photonic Stack
- 2026 Predictions: System-Level Design, AI-Native Workflows, and the Rise of Multi-Die Compute Fabrics
- Accelerating Chiplet Integration in Heterogeneous IC Package Designs