The APECS Pilot Line: Heterointegration enabling Chiplet Applications
The semiconductor industry is increasingly relying on modular chiplet systems to maintain the exponential growth in computing power. Innovative technologies such as 3D heterointegration and electro-optical co-packaging play a central role in this endeavor.
The Fraunhofer Institute for Reliability and Microintegration IZM is actively promoting the development and integration of chiplet technologies as part of the APECS pilot line, which is being set up as part of the EU chip program to promote chiplet innovations and build up more research and production capacity for semiconductors in Europe.
In their interview, Rolf Aschenbrenner and Erik Jung from Fraunhofer IZM and Dr. Michael Töpper from the Research Fab Microelectronics Germany (FMD) speak about how the APECS pilot line helps companies introduce novel technologies in the field of advanced packaging and the integration of chiplets.
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