Signal integrity and power integrity analysis in 3D IC design
The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional monolithic SoCs to heterogeneous integrated advanced package ICs, including 3D integrated circuits (3D ICs). This emerging technology promises to help semiconductor companies sustain Moore’s Law.
However, these advancements bring increasingly complex challenges, particularly in power integrity (PI) and signal integrity (SI). Once secondary, SI/PI have become critical disciplines in modern semiconductor development. As data rates ascend into multiple gigabits per second and power requirements become more stringent, error margins shrink dramatically, making SI/PI expertise indispensable. The fundamental challenge lies in ensuring clean and reliable signal transmissions and stable power delivery across intricate systems.
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