RISC-V and Chiplets: A Panel Discussion
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
- Laurent Moll, COO of Arteris
- Aniket Saha, VP of Product Management of Tenstorrent
- Dale Greenley, VP of Engineering of Ventana Microsystems
- Rob Aitken, Distinguished Architect of Synopsys
This is a slightly odd combination of topics to me. Obviously, you can put a RISC-V processor on a chiplet but the challenges are not really different from any other processor. But RISC-V is hot and so are chiplets, and companies like Ventana are combining them.
Let me give you a bit of background about the companies to put them in context:
- As you probably know, Arteris makes networks-on-chip (NoCs). It is a neutral company among chiplet vendors (and IP vendors).
- Tenstorrent is designing a portfolio of very high-performance multicore RISC-V chips
- Ventana has RISC-V IP but it also delivers it as chiplets
- Synopsys is obviously an EDA company but they announced RISC-V cores earlier in the summit
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Blogs
- RISC-V Chiplets, Disaggregated Die, and Tiles
- Why Chiplets and why now?
- What are Chiplets and how they Assemble Into the Most Advanced SoCs
- How Disruptive will Chiplets be for Intel and TSMC?
Latest Blogs
- Stretching the antenna: Advanced antenna tuning with 9SW and SLATE™ advanced packaging technology on 9SW
- Chiplet Architectures as a Practical Path to Scalable Automotive Compute
- Unstacking the Future: Navigating the 3D IC Frontier
- Multi-Die, Multiphysics, and the New Rules of Chip Design
- Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors