Moderating Our Open Chiplet Enthusiasm. A NoC Perspective

By Bernard Murphy

February 14, 2024

I recently talked with Frank Schirrmeister (Solutions & Business Development, Arteris) on the state of progress to the open chiplet ideal. You know – where a multi-die system in package can be assembled with UCIe (or other) connections seamlessly connecting data flows between dies. If artificial general intelligence and industrial-scale quantum computing are right around the corner, surely any remaining issues in open chiplet design should be a snap to resolve? According to Frank, the answer is yes and no. For a couple of privileged groups, anything is possible and is being put into practice today. For larger open markets, not so much, at least not in the near term.

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