Chiplets revolutionizing semiconductor design and integration
IDTechEx, USA, organized a conference today on Chiplet technology: Revolutionizing semiconductor design and integration.
Chiplets are transforming semiconductor design and integration. They provide comparison with traditional system-on-chip (SoC) and system-in-package (SiP) technologies. They also introduce the concept of heterogeneous integration.
Dr Xiaoxi He, Research Director, Topic Lead, IDTechEx, stated that chiplets have modular architecture, supply chain resilience, etc. Slowing of trend was predicted by Moore’s Law. We are seeing scaling and integration, system-level improvement with advanced packaging, and material innovation and optical approaches.
Chiplets for HPC chips have several players such as AMD, Intel, Xilinx, Apple, AWS, Broadcom, Marvell, Nvidia, AmpereOne, etc. SoC vs. chiplet looks at monolithic die. Chiplets have modularity! They are easily scalable, and customizable, leading to easy optimization for specific tasks. Parallel development can reduce TTM. Chiplets require interconnect technology among / between chiplets.
The chiplet is discrete modular semiconductor component of functional blocks that are co-designed, and manufactured. They are connected through standardized high-speed digital interface, to be integrated to a larger chip or system, resembling a complete SoC on module.
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