Automated Driving: ZF and SiliconAuto Reveal New I/O Interface Chip with Companion Microcontroller
2026-03-16 07:30:15
Chiplet Ecosystem Insights
Ecosystem Highlights
Expert Perspectives
Advancing High‑Performance Silicon Photonics and Silicon Germanium (SiGe) for the Next Era of Optical Connectivity
March 16, 2026
Accelerating Chiplet Innovation with a New Partner Ecosystem
March 4, 2026
Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design
March 4, 2026
Six critical trends reshaping 3D IC design in 2026 and beyond
March 3, 2026
Recent Updates
Automated Driving: ZF and SiliconAuto Reveal New I/O Interface Chip with Companion Microcontroller
2026-03-16 07:30:15
Ecosystem & Strategy
Raja Koduri's OXMIQ has signed a new Customer with AM Intelligence Labs
2026-03-16 06:45:00
Business & Deals
Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
2026-03-13 06:23:12
Interconnects & Integration
Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
2026-03-11 19:10:40
Interconnects & Integration
Arm Positions Neoverse for AI and Telco Networks at MWC
2026-03-11 19:04:36
Analysis & Commentary
NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily
2026-03-11 18:58:57
Analysis & Commentary
CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects
2026-03-11 18:51:22
Manufacturing & Supply Chain
HyperLight, UMC, and Wavetek Announce Strategic Partnership for High-Volume Foundry Production of TFLN Chiplet™ Platform
2026-03-11 18:44:00
Manufacturing & Supply Chain
Adeia and UMC Expand Long-Term Collaboration in Hybrid Bonding Technologies
2026-03-11 18:36:53
Business & Deals
Lightmatter Unveils vClick™ Optics, Industry-First Detachable Fiber Array Unit for CPO Advanced Packaging and High-Volume Production
2026-03-11 18:31:13
Interconnects & Integration
Ayar Labs and Wiwynn Partner to Bring Co-Packaged Optics to Rack-Scale AI Systems
2026-03-11 18:18:00
Ecosystem & Strategy
TIER IV joins imec’s Automotive Chiplet Program to accelerate chiplet-based architectures and AI accelerators for SDVs
2026-03-10 07:48:00
Ecosystem & Strategy
Adeia Enters into Multi-Year IP License Agreement with AMD
2026-03-09 12:19:46
Business & Deals
STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
2026-03-09 11:46:00
Interconnects & Integration
Vertical Compute raises €57M to solve the AI memory bottleneck with new high density memory
2026-03-04 11:28:00
Business & Deals
Ayar Labs Closes $500M Series E, Accelerates Volume Production of Co-Packaged Optics
2026-03-03 11:20:12
Business & Deals
NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
2026-03-02 12:26:42
Interconnects & Integration
GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
2026-02-26 00:00:00
Chiplet-Ready IP
GLS and APES Announce Advanced Semiconductor Packaging Partnership
2026-02-25 08:10:35
Ecosystem & Strategy
Ayar Labs Names Sankara Venkateswaran as Vice President of Engineering
2026-02-23 19:30:31
Other