CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
2026-04-03 09:27:00
Chiplet Ecosystem Insights
Ecosystem Highlights
AEM and ASE Enter Strategic Partnership to Accelerate AI and HPC Test Innovation
2026-03-24 07:01:53
Expert Perspectives
Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
April 2, 2026
UCIe Manageability: The Hidden Control Plane of Chiplet Systems
April 2, 2026
Simulation Solutions for the Structural Integrity of Chip Packages
March 27, 2026
Overcoming interconnect obstacles with co-packaged optics (CPO)
March 27, 2026
Recent Updates
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
2026-04-03 09:27:00
Ecosystem & Strategy
NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
2026-03-30 15:24:41
Standards & Research
Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion
2026-03-30 15:16:29
Business & Deals
EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
2026-03-30 09:54:00
Analysis & Commentary
Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs
2026-03-25 07:23:22
Standards & Research
AEM and ASE Enter Strategic Partnership to Accelerate AI and HPC Test Innovation
2026-03-24 07:01:53
Business & Deals
NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries
2026-03-18 06:45:29
Manufacturing & Supply Chain
Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
2026-03-18 06:27:00
Interconnects & Integration
Open EU Foundry status granted to innovative chiplet facility
2026-03-17 08:20:17
Manufacturing & Supply Chain
Siluxtek and GlobalFoundries Forge a Deep Strategic Partnership to Mass-Produce 200G/Lane Silicon Photonic Receiver Chips, Paving the Way for the Industrial Revolution of AI Computing Interconnects
2026-03-17 07:24:28
Manufacturing & Supply Chain
Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform
2026-03-17 07:10:41
Design, Tools & Validation
Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows
2026-03-16 20:49:13
Design, Tools & Validation
Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
2026-03-16 13:34:02
Ecosystem & Strategy
Marvell and Lumentum to Demonstrate Optical Circuit Switching for Next-generation AI Scale-up Infrastructure
2026-03-16 13:24:00
Interconnects & Integration
Automated Driving: ZF and SiliconAuto Reveal New I/O Interface Chip with Companion Microcontroller
2026-03-16 07:30:15
Ecosystem & Strategy
Raja Koduri's OXMIQ has signed a new Customer with AM Intelligence Labs
2026-03-16 06:45:00
Business & Deals
Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
2026-03-13 06:23:12
Interconnects & Integration
Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
2026-03-11 19:10:40
Interconnects & Integration
Arm Positions Neoverse for AI and Telco Networks at MWC
2026-03-11 19:04:36
Analysis & Commentary
NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily
2026-03-11 18:58:57
Analysis & Commentary