Advancing the Open Chiplet Ecosystem with UCIe 2.0

By Brian Rea

August 7, 2024

Welcome to the cutting-edge world of chiplet technology[1], where the Universal Chiplet Interconnect Express (UCIe) is revolutionizing on-package connectivity. UCIe is not just any standard—it's a game changer, delivering high-speed, energy-efficient, cost-effective links between chiplets[2]. Solutions across the computing spectrum from mobile to automotive to datacenter to AI can increase innovation and reduce time to market by leveraging chiplets that are built with open-standard-based interconnects.

With more than 130 member companies who are leading suppliers and consumers of chiplet-based architectures, the UCIe specification has been evolving to address the needs of next generation chip designs. UCIe 2.0 builds upon the foundation of the UCIe 1.0/1.1 specifications and is fully backwards compatible. With UCIe 2.0, we're tackling the complexities of multi-chiplet systems head-on, helping to ensure everything from manageability to testing is being built into the specification. And for those who like to push boundaries, UCIe-3D offers ultra-fine pitches and hybrid bonding.

UCIe 2.0 marks a significant leap forward in the realm of 3D packaging[3], setting the stage for a transformative increase in bandwidth density and power efficiency. This evolution is not just about stacking chips; it's about redefining the very fabric of system architecture. By enabling a vertical labyrinth of interconnected chiplets, UCIe 2.0 promises a future where data highways are more compact yet vastly more efficient, allowing for a surge in processing power without the penalty of increased energy consumption. This is the kind of innovation that propels industries forward, offering system designers the tools to build the next generation of electronic devices that are both powerful and energy conscious.

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