AI and Semiconductor in Reciprocity

By Dr. Mike Hung - Senior Vice President

January 21, 2025

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other.

Semiconductor Packaging: The Bridge between Chip and System

The semiconductor market is projected to reach a trillion-dollar by 2030. As wafer technology advances, the L/S (line width/line space) gap between IC and system boards has widened to a phenomenal 2700x compared with an initial 50x. Advanced packaging technology has become essential in bridging this gap. Semiconductor packaging not only provides improvements to system performance but is also a critical foundation for the development of AI. By 2030, the market value of semiconductor packaging alone is expected to reach $150 billion.

Semiconductor Development Trends

The future advancements in semiconductors are primarily centered around three key trends: More Moore, More than Moore, and heterogeneous integration. More Moore is the continuation of Moore’s Law, which aims to scale down transistor size as well as increases transistor density within an integrated circuit while maintaining or enhancing performance. This approach is crucial for the development of GPUs, CPUs, application processors (AP), memory, and logic ICs. More than Moore focuses on the functional diversification of integrated circuits. It emphasizes the development of new materials and functionalities on the chip, playing a vital role in the development of analog, RF, power, passive components, sensors, and even biochips. Heterogeneous integration involves combining various components—such as logic chips, sensors, and memory—to improve system functionality and performance, primarily through two major platforms: advanced packaging and system-in-package (SiP).

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