Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
October 14, 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the design process for these cutting-edge solutions has been critical, and 3DBlox is central to this mission. 3DBlox is an innovative framework inclusive of a standardized design language, introduced by TSMC aimed at addressing the complexities of 3D integrated circuit (3DIC) design. The following is a synthesis of that talk, delivered by Jim Chang, Deputy Director at TSMC for the 3DIC Methodology Group.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related Blogs
- How Cadence Is Expanding Innovation for 3D-IC Design
- Using Voltus IC Power Integrity to Overcome 3D-IC Design Challenges
- How to Make Chiplets a Viable Market
- Revolutionizing Automotive Design with Chiplet-Based Architecture
Latest Blogs
- Scaling AI Data Centers: The Role of Chiplets and Connectivity
- Is a GPU, ASIC or chiplet-based SoC better for AI as we switch from training to inference?
- Siemens EDA intros next-gen ESD; focus on chiplet-design kits (CDK)
- Accelerating the AI Economy through Heterogeneous Integration
- Outlook 2025: Embracing Chiplets