Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the design process for these cutting-edge solutions has been critical, and 3DBlox is central to this mission. 3DBlox is an innovative framework inclusive of a standardized design language, introduced by TSMC aimed at addressing the complexities of 3D integrated circuit (3DIC) design. The following is a synthesis of that talk, delivered by Jim Chang, Deputy Director at TSMC for the 3DIC Methodology Group.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Blogs
- How Cadence Is Expanding Innovation for 3D-IC Design
- Using Voltus IC Power Integrity to Overcome 3D-IC Design Challenges
- Cadence Collaborates with TSMC to Shape the Future of 3D-IC
- Cadence Recognized for Accelerating AI and 3D-IC Applications by Samsung Foundry
Latest Blogs
- The IOHub. An Emerging Pattern for System Connectivity in Chiplet-Based Designs
- Putting 3D IC to work for you
- Blazing the Trail Toward More Scalable, Affordable AI with 3DIMC
- Why Electrical Design Matters in Chiplet Architectures – Part One: Signal Integrity and Power Delivery
- A Smarter Path To Chiplets Through An Enhanced Multi-Die Solution