Alphawave Semi - Chiplet Ecosystem

Alphawave Semi’s leading IP and custom silicon expertise is integrated into a foundation for prebuilt connectivity chiplets. This cost effective and flexible approach delivers connectivity at a higher bandwidth and lower power than traditional infrastructure solutions. Advanced package technologies have made it possible to intelligently combine various chip functions by stacking die onto a universal substrate. Using the N-1 (or even N-2) process for the IO chiplet can increase savings and decrease time to market by breaking up the SOC into smaller, more efficient building blocks.