Why There Are Still No Commercial 3D-ICs
By Brian Bailey, Semi Engineering (January 29th, 2024)
More than Moore is off to a good start, but the next steps are a lot more difficult.
Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Why Chiplets Are So Critical In Automotive
- How and Why Chiplets are Growing in Use and Need
- Are Chiplets Enough to Save Moore's Law?
- Proprietary Vs. Commercial Chiplets
Latest News
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
- When Standards Enable Chiplets
- Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- CoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL