Why There Are Still No Commercial 3D-ICs
By Brian Bailey, Semi Engineering (January 29th, 2024)
More than Moore is off to a good start, but the next steps are a lot more difficult.
Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- Why Chiplets Are So Critical In Automotive
- How and Why Chiplets are Growing in Use and Need
- Are Chiplets Enough to Save Moore's Law?
- Proprietary Vs. Commercial Chiplets
Latest News
- HyperLight Launches TFLN Chiplet™ Platform with Scalable 6-Inch Production and 8-Inch Expansion for Next-Gen AI and Photonics Infrastructure
- Intel’s Embarrassment of Riches: Advanced Packaging
- Challenges In Managing Chiplet Resources
- Global Fab Equipment Investment Expected to Reach $110 Billion in 2025
- X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC