Onto Innovation Advances Process Control Suite for 3D Interconnect Yields

Announces orders for 3Di^™ technology on Dragonfly^® G3 system and release of EchoScan^™ void detection system

WILMINGTON, Mass.-- January 14, 2025 -- Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di^™ technology on the Dragonfly^® G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan^™ system is introduced for detecting voids as small as 1µm in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. The first EchoScan system will ship in the first quarter, with additional tools planned to ship to customers throughout 2025.

Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing (HVM) are decreasing from 12µm to 8µm, and potentially to 4µm. As bump sizes decrease, metrology and inspection become increasingly critical to ensuring high yields.

“High-performance HBM and GPU devices powering AI packages demand smaller line/space and bump pitch requirements,” says Mike Rosa, Onto’s chief marketing officer and senior vice president of strategy. “Onto designed the 3Di technology to meet customers’ needs for more stable technologies accommodating smaller bump sizes—even below 5µm in HVM and 2µm in R&D—in next generation logic and memory devices.”

Interconnect density intensifies with the adoption of hybrid bonding for bond pad interconnects, with planar bump heights and the challenge of inline micro void detection at the Cu-Cu bond pad interface. Undetected voids can lead to wafer cracking and open electrical connections, resulting in yield loss. Current technologies are limited to ≥10µm void size sensitivity and require water immersion, which adds the risk of bonded wafer contamination, delamination and lack of void traceability for inline process control.

“Onto’s EchoScan system offers die and wafer level, immersion free, non-contact technology for voids down to 1µm in HVM. This solution is being released to select customers to detect 1µm voids in atmosphere at the same speed as incumbent technologies limited to ~10µm,” Rosa continued. “Whether using micro bump or hybrid bonding technologies, Onto Innovation provides the critical process control solution. When paired with our Discover^® analytical software, both solutions enable real-time defect analysis and feedback to process tools for statistical process control, reducing the cycle time of yield loss assessment and helping customers achieve high volume manufacturing goals.”

To learn more about the 3Di technology on the Dragonfly G3 system and the EchoScan void detection system, contact us or reach out to your local sales team.

About Onto Innovation Inc.

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that includes un-patterned wafer quality, 3D metrology spanning chip features from nanometer scale transistors to large die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging.

Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization.

Additional information can be found at www.ontoinnovation.com.