Monolithic Vs. Heterogeneous Integration
New processes, materials, and combinations of existing technologies will determine future directions for semiconductors.
By Ed Sperling, SemiEngineering (October 24th, 2024)
Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what’s needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnuswamy, managing director at Lam Research. This discussion was held in front of a live audience at SEMICON West.
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
- Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024
Latest News
- Three-Way Race To 3D-ICs
- Promex Industries Expands Best-in-Class Capabilities, Installing Laser Depaneling and Advanced SPI Systems on Manufacturing Line
- Cyber Threats Multiply With Commercial Chiplets
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- Intel Foundry Gathers Customers and Partners, Outlines Priorities