Monolithic Vs. Heterogeneous Integration
New processes, materials, and combinations of existing technologies will determine future directions for semiconductors.
By Ed Sperling, SemiEngineering (October 24th, 2024)
Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what’s needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnuswamy, managing director at Lam Research. This discussion was held in front of a live audience at SEMICON West.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
- Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024
Latest News
- Chiplet-Based Solutions Accelerate the Development of Embedded NVM
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation
- BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem
- Astera Labs to Acquire aiXscale Photonics