Revolutionary Flip-Chip Die Bonder from ITEC is 5x Faster than Market’s Best

May 28, 2024 -- Attaching up to 60,000 flip-chip dies per hour, ITEC’s ADAT3 XF TwinRevolve Flip-Chip Die Bonder runs five times faster than other such bonders. That means fewer machines are needed, which cuts factory space and running costs to give by far the industry’s lowest Total Cost of Ownership (TCoO). The machine has an accuracy better than 5 μm @ 1σ and opens possibilities for a whole new generation of products where flip-chip assembly was previously too slow and too expensive. Beside this, flip-chip packages are more reliable, have a lower power consumption and have better high-frequency and thermal performance than the wire bonds they replace. 

ITEC’s new flagship die bonder picks, flips and places the die in a fast, smooth action. Instead of the traditional forwards and backwards up/down linear motion, there are two rotating heads (‘TwinRevolve’) so there’s less inertia and less vibration. That allows the same accuracy at much higher speeds, so chipmakers can now upgrade their high-volume wire-bonded products to flip chips. 

“Our new die bonder is a game changer, and ideal for customers to design in a new generation of advanced flip chips and chiplets in the ‘factory of the future “, says Mark van Kasteel, Commercial Director at ITEC. “Operation is automatic, and you need a fifth of the factory floor space to achieve this high output. There’s less maintenance, fewer operator hours, fewer spare parts, and lower energy consumption. That means a much smaller carbon footprint, too”. 

FAST, AUTOMATED OPERATION

ITEC’s ADAT3 XF (eXtended Flexibility) range includes the market’s fastest and most advanced die bonders and die sorters. As with the whole family, the new flip-chip die bonder is modular and field upgradable for extended lifetime and even more sustainable operation. An autoloader for strip magazines (in-outgoing) takes four magazines at a time, and (optionally) are enabled with E142 substrate mapping. There’s an automatic wafer change with barcode reader. The machine accepts 8- to 12-inch (200- to 300-mm) wafers. There’s full die traceability, auto recipe download (MES interface) and SECS/GEM interface. 

A separate flux screen printer can be added as an inline-setup or the TwinRevolve can run as a standalone tool with strip magazine input/output, a flux screenprint inspection module is an option.

Full Servo-controlled bond-force/pick-force and auto-diagnostics check the machine’s health status. Five high-resolution (up to 5 Mpixel) cameras at key process points help keep operation under close control. They monitor glue, pre-pick, back/front side, post-bond and optional sidewall. Flux-related inspection includes drop size and shape, and coverage with respect to Cu pillar size.

WIDE RANGE OF PACKAGES

The die bonder takes several types of QFN, DFN, HVQFN, SOT, SO, TSSOP and LGA leadless and leaded packages, and can handle 100x300 mm strip size.

ABOUT ITEC

Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer specializing in high-volume production of semiconductors. ITEC provides the highest productivity assembly, test, inspection and Smart manufacturing platforms, targeting mass volume manufacturing from small signal to power MOS devices. 

ITEC is rooted in semiconductor manufacturing, combining over 30 years of state-of-the-art equipment and automation expertise as partner to Philips and Nexperia. In 2021, ITEC became a separate legal entity. For more information, explore our website - www.itecequipment.com.