DreamBig closes $75M Series B Funding Round, Co-led by Samsung Catalyst Fund and Sutardja Family to Enable AI Inference and Training Solutions to the Masses

DreamBig's open MARS Chiplet Platform with a leading Chiplet Hub^TM for scale-up and Networking IO Chiplets for scale-out enables customers to compose the most advanced AI solutions

SAN JOSE, Calif., July 16, 2024  -- DreamBig Semiconductor Inc., a pioneer in high-performance accelerator platforms utilizing its industry-leading Chiplet Hub™ with 3D HBM, today announced a $75M equity funding round. This round was co-led by the Samsung Catalyst Fund and the Sutardja Family. New investors include Samsung, Hanwha, Event Horizon, and Raptor, alongside continuing contributions from existing stakeholders including the Sutardja Family, UMC Capital, BRV, Ignite Innovation Fund, Grandfull Fund, amongst others.

These funds will bolster the development and commercialization of products built on DreamBig's Chiplet Hub™ and Platform Chiplets. "This investment underscores the market's recognition of DreamBig as a transformative force in AI and data center infrastructure," stated Sohail Syed, Co-founder and CEO of DreamBig. "Our open MARS Chiplet Platform enables unparalleled scale-up and scale-out solutions so customers can achieve the highest levels of performance and energy efficiency at lowest cost and fastest time-to-market."

"We are delighted to co-lead DreamBig's Series B round and partner with an exceptional team leading the path to streamline chiplet-based AI solutions," said Marco Chisari, Head of Samsung Semiconductor Innovation Center and Executive Vice President, Samsung Electronics. "The ever-growing demands for intensive workloads and memory-bound applications – from generative AI to automotive – are fueling the need for more advanced chiplet-based designs with 3D HBM stacking."

The Chiplet Hub™ and Networking Chiplets deliver highly differentiated capabilities:

• Universal architecture support for CPU, AI, Accelerators, IO, Networking, and Memory Chiplets within a unified platform
• Memory-First Architecture for direct access from all chiplets to 3D stacked HBM, DDR, CXL, and SSD memory tiers
• FLC Technology Group fully associative hardware acceleration for Cache/Memory management
• DMA hardware for efficient memory data transfer from any source to any destination managed by the Chiplet Hub
• Virtual PCIe/CXL switch for optimized resource allocation
• Ethernet/UEC RDMA hardware for enhanced scalability
• Multi-Gigabit, low power Content Addressable Memory  for precision Match/Action processing at 800Gbps

"We are extremely proud of DreamBig's accomplishments and its open MARS Chiplet platform with world leading Chiplet Hub^TM for scale-up and Networking IO Chiplets for scale-out enables customers to compose the most advanced AI solutions with UCIe/BoW compliant Chiplets leveraging Silicon Box Panel Level Packaging for the masses",  stated Sehat Sutardja and Weili Dai, Co-founders and Chairman/Chairwoman of DreamBig. "It is our passion and determination to drive innovation by offering the most advanced technology for the new era of semiconductor Chiplet solutions globally. In the last several years, we have cofounded and invested in numerous companies to develop disruptive technologies which DreamBig has leveraged to lead the pack for the new Chiplet era."

About DreamBig

Founded in 2019, DreamBig is developing a cutting-edge chiplet platform that drives the next wave of affordable, scalable, and modular semiconductor solutions for the AI era and beyond. DreamBig is renowned for providing the most advanced Chiplet Hub, facilitating the scaling of processor, accelerator, and networking chiplets. The company's specialties include applications in Large Language Models (LLMs), Generative AI, Data Centers, Edge computing, and Automotive sectors.