BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology
June 17, 2025 -- BOS Semiconductors is proud to announce our membership in VESA (Video Electronics Standards Association) and UCIe (Universal Chiplet Interconnect Express)—two global alliances leading the development of key semiconductor standards.
VESA, established in 1989, is known for defining open display interface standards such as DisplayPort, DisplayHDR, and Adaptive-Sync. These technologies are widely adopted in high-performance monitors, PCs, and automotive displays.
UCIe, founded in 2022, focuses on universal chiplet interconnect standards, enabling high-speed, low-power communication between chiplets inside advanced packages. The consortium includes leading companies such as Intel, AMD, Samsung, and TSMC, all working to drive the future of chiplet-based architectures.
By joining both VESA and UCIe, BOS is reinforcing its commitment to modular, high-performance semiconductor solutions. These memberships will allow us to:
- Collaborate with global standard-setting leaders
- Ensure greater interoperability and scalability in our products
- Strengthen the long-term reliability and competitiveness of our technology
This marks an important step in our journey to help build a more open, flexible, and innovation-driven ecosystem for advanced SoCs and AI accelerators.
We look forward to contributing actively and creating value for the broader semiconductor community.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
- Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
- Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
- QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets
Latest News
- Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform
- EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025
- HyperLight Introduces 110 GHz Reference IQ Modulators covering optical O, C and L wavelength bands for 240 GBaud Class Applications
- YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung