SoCs Get a Helping Hand from AI Platform FlexGen
By Gary Hilson, EETimes | March 21, 2025

FlexGen, a network-on-chip (NoC) interconnect IP, is aiming to accelerate SoC creation by leveraging AI.
Developed by Arteris Inc., FlexGen promises to deliver a 10× productivity boost while reducing design iterations and the time required to develop. In a briefing with EE Times, Arteris CMO Michal Siwinski said FlexGen achieves up to a 30% reduction in wire length to lower power use, as well as up to 10% reduction in latency that results in improved performance in SoC and chiplet designs.
“It will actually do the process of generating that network on chip, generating that interconnect and it will actually generate however many interconnects are required to meet the requirement,” Siwinski said.
Using AI and machine learning for chip design isn’t new, Siwinski said, but often the productivity boosts come at the cost of performance or power. FlexGen is able to reduce the number of elements on the critical path of a project, while also improving power/performance metrics, which he said is unique.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Arteris Deployed by Menta for Edge AI Chiplet Platform
- Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
- STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
Latest News
- Accelerating Development of Mass-Production Technologies for Photonics-Electronics Convergence Devices to Support Next-Generation AI Computing
- BOS Semiconductors Partners with LG Electronics and HANA Micron to Advance Domestic Development of Chiplet-Based Automotive Semiconductors
- Innolux's Deployment of Key FOPLP Technologies: Leading Next-Gen Advanced Packaging and Seizing AI Opportunities
- Wiwynn, Ayar Labs, and GUC Advance Co-Packaged Optics with Live Demonstration of Integrated Optical Compute System at OCP Global Summit 2026
- ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation