Arm’s Chiplet System Architecture eyes ecosystem sweet spot
By Majeed Ahmad, EDN (January 27, 2025)
Arm has announced the availability of the first public specification drafted around its Chiplet System Architecture (CSA), a set of system partitioning and chiplet connectivity standards harnessed in a design ecosystem supported by over 60 companies. The companies that are part of the CSA initiative include ADTechnology, Alphawave Semi, AMI, Cadence, Jaguar Micro, Kalray, Rebellions, Siemens, and Synopsys.
CSA aims to offer industry-wide standards and frameworks by facilitating the reuse of specialized chiplets, and thus address the fragmentation caused by compatibility issues in chiplet design. It provides a shared understanding of defining and connecting chiplets while developing composable system-on-chips (SoCs).
A couple of recent announcements show how semiconductor firms are employing CSA to build chiplets as part of Arm Total Design, a platform for deploying chiplet-based compute subsystems. Arm Total Design facilitates custom silicon solutions powered by Arm Neoverse Compute Subsystems (CSS), which includes processor cores, IPs, software, and design tools.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence Unveils Arm-Based System Chiplet
Latest News
- Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
- Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
- NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium
- Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
- Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology