Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets

Join Alphawave Semi for a free live-streamed event exploring chiplet-based systems and the opportunities they present

LONDON, United Kingdom, and TORONTO, Canada – July 29, 2025 - Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced four of its technical experts have been invited to present on building chip for the AI era at EE Times Presents: The Future of Chiplets.

Beginning July 30, and live-streamed on chiplets.eetimes.com, the two-day free event seeks to advance the industry's knowledge on the realities of working with and building chiplet-based systems for AI. The event will bring many of the industry’s leading experts together – including those from Arm, Cadence, Siemens EDA, and Semi – and seeks to show how chiplet-based architectures enable enhanced performance, reduced transmission bottlenecks, better yields and lower costs versus monolithic ICs.

It will be hosted and moderated by EE Times’ Editor in Chief and Senior AI Reporter, Nitin Dahad, and Sally Ward-Foxton, respectively.

Letizia Giuliano, Vice President of IP Product Marketing and Management at Alphawave Semi, said, “As the demand for faster, more efficient data movement continues to grow, traditional chip designs are reaching their limits. At Alphawave Semi, we’re driving innovation with advanced chiplet architectures and next-generation connectivity solutions—both electrical and optical—that unlock higher performance and energy efficiency.

“Our presentations will highlight how these technology advancements are shaping the future of high-speed computing and data infrastructure.”

How to view the presentations

All panel discussions and presentations will be streamed live and for free following registration. To register and view the event’s full agenda, visit chiplets.eetimes.com.

Scaling AI Compute with Next Generation of UCIe Die-to-Die Interface Enabled Chiplets
July 30: (9:55 AM Pacific, 12:55 PM Eastern, 5:55 PM UK, 6:55 PM CEST)
Mike Klempa, Principal Engineer, Alphawave Semi
 
Chiplet Advantages with Ethernet and PCIe Scaling Across Copper and Optics
July 30: (11:50 AM Pacific, 2:50 PM Eastern, 7:50 PM UK, 8:50 PM CEST)
Sue Hung Fung, Principal Product Line Manager, Alphawave Semi
 
Evolution of HBM (High Bandwidth Memory) in the Chiplet Ecosystem Era
July 31: (10:00 AM Pacific, 1:00 PM Eastern, 6:00 PM UK, 7:00 PM CEST)
Archana Cheruliyil, Principal Product Marketing Manager, Alphawave Semi
 
Panel Discussion: Enabling New Design Directions
July 31: (10:55 AM Pacific, 1:55 PM Eastern, 6:55 PM UK, 7:55 PM CEST)
Letizia Giuliano, VP of IP Product Marketing and Management, Alphawave Semi; Vladimir Stojanovic, CTO and Co-Founder, Ayar Labs; Ramin Farjadrad, founding CEO, Eliyan; Ritesh Jain, SVP of Engineering and Operations, Lightmatter
Moderated by Sally Ward-Foxton, Senior Reporter, EE Times.

For further information on Alphawave Semi, please visit www.awavesemi.com.

About Alphawave Semi

Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, connectivity products and chiplets are deployed by global tier-one customers in data centres, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world. To find out more about Alphawave Semi, visit: awavesemi.com.