Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
By Letizia Giuliano, VP of IP Products, Alphawave Semi
EETimes (February 6, 2025)

Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.
Large AI clusters require significant networking infrastructure to handle the data flow between the processors, memory, and storage; without this, the performance of even the most advanced models can be bottlenecked. Data from Meta suggests that approximately 40% of the time that data resides in a data center is wasted, sitting in networking.
In short, connectivity is choking the network, and AI requires dedicated hardware with the maximum possible communication bandwidth.
Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.
Large AI clusters require significant networking infrastructure to handle the data flow between the processors, memory, and storage; without this, the performance of even the most advanced models can be bottlenecked. Data from Meta suggests that approximately 40% of the time that data resides in a data center is wasted, sitting in networking.
In short, connectivity is choking the network, and AI requires dedicated hardware with the maximum possible communication bandwidth.
The large training workloads of AI create high-bandwidth traffic on the back-end network, and this traffic generally flows in regular patterns and does not require the packet-by-packet handling needed in the front-end network. When things are working properly, they operate with very high levels of activity.
Low latency is critical, as we must have fast access to other resources, and this is enabled by a flat hierarchy. To prevent (expensive) compute being left underutilized, switching also must be non-blocking—it should be noted that the performance of AI networks can be bottlenecked by even one link that has frequent packet losses. Robustness and reliability of the networks are also critical, with the design of the back-end ML network taking this into consideration.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers
- Marvell and Lumentum to Demonstrate Optical Circuit Switching for Next-generation AI Scale-up Infrastructure
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
Latest News
- Chiplet-Based FPGAs Optimize Performance for Space Applications
- Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack
- From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future
- Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
- HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem