What’s Next In Advanced Packaging?
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.
By Ed Sperling And Laura Peters, Semi Engineering (February 19th, 2025)
Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions.
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