What’s Next In Advanced Packaging?
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.
By Ed Sperling And Laura Peters, Semi Engineering (February 19th, 2025)
Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- After TSMC fab in Japan, advanced packaging facility is next
- Two big reliability problems in advanced packaging
- SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
- Advanced packaging revenue dropped 9% in Q1 2024, but recovery is expected in 2024
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs