UCIe Goes Back To The Drawing Board

By Gregory Haley, SemiEngineering (February 22, 2024)

The open chiplet interconnect protocol faces some formidable challenges, but progress continues.

The integration of multiple dies within a single package increasingly is viewed as the next evolution for extending Moore’s Law, but it also presents myriad challenges — particularly in achieving a universally accepted standard integrating plug-and-play chiplets from different vendors.