After TSMC fab in Japan, advanced packaging facility is next
By Majeed Ahmad, EDN (March 18, 2024)
Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement the chip manufacturing ecosystem in Japan amid considerations to diversify semiconductor supply chains beyond Taiwan due to geopolitical tensions. Trade media has been abuzz about TSMC setting up an advanced packaging plant and a new Reuters report supports this premise.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
- Asahi Kasei Adds New Slitting Facility for SUNFORT™ to Meet Growing Demand for Advanced Semiconductor Packaging
Latest News
- JEDEC® Announces Creation of JC-14.8 Subcommittee on System Level Reliability Testing (SLRT); Invites Industry Participation
- UCIe Consortium Advances from Chiplet Connectivity to System-Level Integration with UCIe 4.0 Specification
- Netherlands and Taiwan Launch Four Joint Photonics R&D Projects
- ASRA and imec release joint architectural requirements for interoperable automotive chiplets
- Crealights’ Self-Developed Silicon Photonics Chip “Greyhound” Makes Its Appearance at CIIE, Showcasing a “Chinese Solution for the Token Economy”