Nvidia, TSMC, and advanced packaging realignment in 2025

By Majeed Ahmad, EDN (January 20, 2025)

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance computing (HPC) applications.

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and the substrate. However, single silicon interposers often confront yield issues.

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