TSMC looks to standardise chiplet protocols in "world changing" move
By Nick Flaherty, eeNews Europe (October 9, 2023)
TSMC is looking to develop a standard data format for chiplet designs that would be used by all the EDA design tool and assembly and test providers.
This is part of a move to the 3D Blox technology for building chiplet designs on the TSMC CoWoS process. The aim is to provide common data for chiplets from different silicon suppliers, substrate and PCB makers and the OSAT assembly and test companies.
“Today most of the chips except for the memories come from TSMC but the goal is to mix and match but that is still some way to go but we are trying to get there,” said Dan Kochpatcharin, head of Design Infrastructure at TSMC.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
- Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform
- Strategic alignment between imec and Japan’s ASRA aims to harmonize standardization of automotive chiplet architectures
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
Latest News
- Staera Semiconductor Emerges from Stealth with US$4.6 Million to Build Light into the Chip and Break AI's Data Bottleneck
- Vertical Compute expands partnership with imec to accelerate commercial manufacturing of Vertically Integrated Memory (VIM)
- Imec advances Europe's silicon interposer technology capabilities through NanoIC pilot line, paving the way for open chiplet design
- SCHMID Group Secures Key Wet-Process Equipment Order for South Asia’s First Glass Core Substrate Manufacturing Facility
- EV Group Helps Accelerate Qubit Scaling for Quantum Computing Through Advanced Packaging Expertise