The chiplet future could be harmonious
By Caroline Hayes, Electronics Weekly | July 17, 2025
There is a general consensus and belief that chiplets are the future, said Abhijeet Chakraborty, VP engineering, Synopsys. There are, however, no illusions about some of the challenges or obstacles that have to be addressed, he added.
The first of these is interoperability and standards. Access to chiplets is essential to design any complex, large system, Chakraborty told Electronics Weekly shortly after participating in a chiplets panel discussion at DAC. “While there are many vendors, the customer has to various tradeoffs, such as cost, which package to use, 2.5D or vertical stacking, thermal issues and power profiles, as well as how to model and how to represent them,” he said.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- YorChip predicts 2026 will be the year of the chiplet
- Alphawave Semi to Reveal Ecosystem and Key Architectures Unlocking Generative AI Potential at EE Times' "Chiplets: Building the Future of SoCs" Seminar
- Paving the way for the semiconductor future: The Chiplet Center of Excellence commences operations
Latest News
- Sarcina Launches UCIe-A/S Packaging IP to Accelerate Chiplet Architectures
- Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
- NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
- Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion