Silicon Box breaks bottleneck in chiplet packaging with sub-5-micron technology

The company’s technology reduces chiplet-based system packaging costs by up to 90%.

In creating chips, designers have the propensity to prioritise manufacturing ease over performance. To eliminate any compromise, Silicon Box has come up with a chiplet integration technology that can expedite chiplet design cycles and reduce the cost of new devices.

Through its sub-5-micron technology proprietary fabrication method, Silicon Box has the “ability to package chiplets with the shortest interconnections,” leading the way for semiconductor integration whilst offering cost benefits to its partners.

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