PacTech Launches Scalable Modular Wet-Bench System for Advanced Semiconductor Packaging

Nauen, Germany – April 14, 2026 – PacTech – Packaging Technologies GmbH, a global provider of advanced packaging equipment and plating solutions, today announced the launch of its new Modular Wet-Bench System, a semi-automated solution designed to address the growing need for flexibility, scalability, and efficiency in semiconductor wet processing.

As wafer-level and panel-level processes become more complex, wet processing infrastructure must adapt. In advanced packaging environments, cleanroom efficiency, modularity, and flexibility are essential for both prototyping and mass production. Conventional wet-bench systems often feature fixed configurations and require significant floor space, limiting adaptability in high-mix manufacturing and fast-paced development environments.

PacTech’s Modular Wet-Bench introduces a new approach by addressing these limitations through a compact, modular architecture. Built around a base module that can be expanded step-by-step, the system is designed to grow alongside evolving process requirements, whether it is deployed in a specialized pilot line or scaled for higher-volume production.

“This modular philosophy not only optimizes capital investment but also ensures consistent process control as production scales, making it a cost-efficient solution for evolving manufacturing needs, particularly in the field of heterogeneous integration,” says Matthias Fettke, Vice President and Head of the Advanced Packaging Equipment Business Unit at PacTech.

Key System Features and Capabilities:

• Space-Efficient Design: Features a compact footprint of approximately 1850 × 1500 mm, optimized for cleanroom environments (ISO 7 and better) where layout efficiency and floor space are critical. Each module houses two tanks designed for 8” substrates.
• Process Versatility: Supports a broad spectrum of wet treatments, including wafer cleaning, stripping, etching, redistribution layer (RDL) development and electroless plating.
• Smart Factory Integration: Enables seamless integration into modern semiconductor production lines through compatibility with industry communication standards such as SECS/GEM and OPC UA.
• Semi-Automated Handling: Includes an optional integrated linear-robotic arm per module to manage agitation and carrier transport between the two 8” tanks, ensuring high repeatability while minimizing process variability and manual intervention.
• Durable Engineering: Constructed from stainless steel or chemically resistant polypropylene (PP), with tank material options including Quartz, PVDF, and PP, ensuring long-term performance in demanding chemical environments.
• Dual-Control Concept: Provides real-time access to production status, system diagnostics, and recipe management via a central monitoring system and local touch interfaces, supporting consistent processing, reliability, and yield.

The Modular Wet-Bench provides a flexible and scalable platform that adapts to changing manufacturing demands, from R&D to production ramp-up. It complements PacTech’s advanced packaging equipment portfolio and PACLINE® electroless plating systems, offering a comprehensive and cost-efficient wet processing solution.

As semiconductor packaging continues to advance, flexible wet processing infrastructure will play a critical role in ensuring long-term competitiveness, reliability, and yield.

The Modular Wet-Bench System is now available for configuration based on customer-specific process requirements. For more information, visit https://pactech.com or contact PacTech’s sales team for a tailored consultation.

About PacTech

PacTech is a global leader in manufacturing laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.