Onshoring Advanced Packaging Update
By Francoise von Trapp, 3DInCItes | April 08, 2025
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
During GTC week, Huang stated that Nvidia ultimately plans to shift manufacturing onshore, and according to Nvidia’s annual report, they have $20 billion in purchase commitments as of January 28 last year. One would assume that the majority of purchase commitments are with TSMC, which, with Nvidia’s $130 billion in revenues for the 2024 calendar year, is close to a year’s supply of chips. Nvidia is reportedly already manufacturing chips at TSMC’s Arizona site; however, these chips are then shipped to Taiwan to get packaged.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Advanced Packaging Moving At Breakneck Pace
- ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany
- ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
- What’s Next In Advanced Packaging?
Latest News
- Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
- ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan
- SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
- AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
- Hamamatsu Photonics develops inverted emission microscope "iPHEMOS®-DDX" for failure analysis of advanced semiconductor packages