Onshoring Advanced Packaging Update
By Francoise von Trapp, 3DInCItes | April 08, 2025
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
During GTC week, Huang stated that Nvidia ultimately plans to shift manufacturing onshore, and according to Nvidia’s annual report, they have $20 billion in purchase commitments as of January 28 last year. One would assume that the majority of purchase commitments are with TSMC, which, with Nvidia’s $130 billion in revenues for the 2024 calendar year, is close to a year’s supply of chips. Nvidia is reportedly already manufacturing chips at TSMC’s Arizona site; however, these chips are then shipped to Taiwan to get packaged.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Intel’s Embarrassment of Riches: Advanced Packaging
- Global Semiconductor IDM Qualifies Veeco Wet Processing Platform for Two New Applications in Advanced Packaging
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers
Latest News
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
- Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence