Novel Assembly Approaches For 3D Device Stacks
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics
By Laura Peters, Semi Engineering | June 30, 2025
The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age.
Not all of these issues are fully solved, the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that have been made over the past couple years since the rollout of ChatGPT shocked the tech world into overdrive. AMD, TSMC, Samsung, Intel, and many equipment suppliers detailed improvements in hybrid bonding, glass core substrates, cooling by microchannels or direct cooling, and heat removal with backside power schemes.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
- Lorentz Solution Jointly Presents with NVIDIA on Large-Scale 3D Terahertz EM Simulation for Real IC/3DIC Silicon Case Studies in Photonic Switches at 2025 TSMC OIP
Latest News
- Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- Marvell Completes Acquisition of Celestial AI
- Chiplet Summit Announces Keynote Speakers
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems