Novel Assembly Approaches For 3D Device Stacks

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics

By Laura Peters, Semi Engineering | June 30, 2025

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age.

Not all of these issues are fully solved, the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that have been made over the past couple years since the rollout of ChatGPT shocked the tech world into overdrive. AMD, TSMC, Samsung, Intel, and many equipment suppliers detailed improvements in hybrid bonding, glass core substrates, cooling by microchannels or direct cooling, and heat removal with backside power schemes.

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