Neuromorphic Photonic Computing: Lights On
By Anne-Françoise Pelé, EETimes Europe | November 26, 2025
As quantum and analog neuromorphic systems move closer to commercialization, new architectures continue to expand the definition of what computing can be.
“Usually, at CEA-Leti, research teams plan five years ahead, but in this case, it’s more like 10 years,” Éléonore Hardy, silicon photonics partnership manager at CEA-Leti, told EE Times Europe at the Silicon Photonics Workshop co-organized by CEA-Leti and Soitec alongside ECOC 2025 in Copenhagen, Denmark. “It’s a fascinating endeavor, and some of us researchers need to go beyond simply meeting the industry’s five-year demands and look to the future.”
Such long-horizon thinking aligns with a broader shift underway in computing. As EE Times highlighted in this year’s Silicon 100, unconventional computing—once a niche academic territory—is emerging as a category of real technological potential. It has come to describe systems that depart from electronic, transistor-based architectures and instead use physical, chemical, biological, or thermodynamic mechanisms for computation. Examples range from reversible computing, which recycles energy and reduces heat dissipation by making computational steps reversible, to molecular computing, which uses DNA, and thermodynamic approaches, which rely on entropy-driven behavior.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
- Celestial AI Announces Photonic Fabric™ Adoption by Lead Hyperscaler Customers
- AMD Receives IEEE 2024 Corporate Innovation Award for Leadership in Chiplet Design for High-Performance and Adaptive Computing
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
Latest News
- CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026