NcodiN secures €3.5 M for optical interposer tech to meet the needs of HPC and AI
NcodiN enables ultra-fast, energy-efficient data communication within next-generation chiplet processors.
By Cate Lawrence, Tech.eu (May 28, 2024)
Optical interposer company NcodiN has successfully secured €3.5 million from Elaia, Earlybird Venture Capital, and OVNI Capital.
NcodiN has developed an optical interposer that enables high-bandwidth, low-latency optical data communications between chiplets within a processor package.
NcodiN’s on-chip integration of ultra-small nanolasers and nanodetectors enables ultra-high integration density - more than 10,000 components per cm2.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- InfiniLink Secures $10M Funding from MediaTek, Sukna Ventures, and Egypt Ventures to Develop Integrated Optical Engines for Next-Gen AI Data Centers
- Pure Player Lightmatter is Securing Optical Interposer Intellectual Property Shares
- CEA-Leti Develops Active Optical Interposers to Connect Chiplets
- Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Latest News
- Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
- Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
- Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- TYLsemi De-Risks Chiplets With New Business Model