MacDermid Alpha to Highlight Advanced Interconnect Solutions for Complex Semiconductor Architectures at IMAPS DPC 2026

Enabling defect-free copper via fill, ultra-fine line and space, and scalable pathways for AI and HPC packaging

Waterbury, CT USA – February 17, 2026 – MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will participate in the IMAPS 22nd Annual Device Packaging Conference. The company will showcase its comprehensive portfolio of wafer fabrication and IC substrate technologies engineered to address the performance, reliability, and scalability challenges of advanced semiconductor manufacturing. Maximize Reliability and Performance for Today’s Complex Architectures

The rapid adoption of high-performance computing (HPC) and artificial intelligence (AI) is accelerating the need for more advanced packaging solutions. Continuous device scaling is driving semiconductors to become smaller, thinner, and more powerful, significantly increasing power density and thermal loads. These trends place unprecedented demands on interconnect performance and long-term reliability, making materials partner selection a critical factor in yield, scalability, and total cost of ownership.

At IMAPS, MacDermid Alpha will highlight how its advanced metallization chemistries, including low alpha tin materials, dual damascene processes, and panel level packaging solutions, support defect reduction, yield optimization, and scalable manufacturing for high-density, highperformance architectures. These technologies support manufacturers in meeting stringent performance and reliability requirements for next-generation applications such as HPC, high-bandwidth memory (HBM), and AI accelerators.

“As architectural density and complexity continue to increase, semiconductor manufacturers require materials that deliver maximum performance, uncompromising reliability, and consistent yields,” said Brian Gokey, Vice President – Wafer Level Packaging, MacDermid Alpha. “As a strategic partner, MacDermid Alpha combines continuous innovation and expert technical support with an agile and flexible development process to deliver unique solutions that enable lower cost of ownership through process efficiency and the fastest time to market.” Interconnect Solutions at the Forefront of Technology

During the WLP2 Conference Session, Saminda Dharmarathna, Ph.D., R&D Line of Business Partner – IC Substrates, will introduce an innovative copper electroplating process specifically developed for advanced IC substrates. As demand grows across AI, 5G, and HPC applications, IC substrates are increasingly incorporating wafer-level precision manufacturing techniques. This evolution requires new plating solutions capable of achieving ultra-fine line and space (L/S) features, defect-free via filling, and highly planar surfaces, all critical to multilayer stack integrity, electrical performance, and long-term reliability.

Saminda’s presentation will highlight how this scalable and efficient technology addresses the combined challenges of miniaturization, defect control, and manufacturability at scale. Paper Title: Enabling AI and HPC: Defect-Free, Co-Planar Copper Via-Fill Plating Process for Advanced IC Substrates Date/Time: March 4, 16:00–16:30

MacDermid Alpha’s technical experts will be available at Booth 503 throughout the conference to discuss how its integrated solutions, advanced materials, and collaborative partnership approach are enabling scalable, proven, high-reliability semiconductor packaging solutions – supporting customers from development to high-volume manufacturing.

For more information visit our website: macdermidalpha.com