Intel details TSMC-made Lunar Lake processor for AI PCs
By Peter Clarke, eeNews Europe (June 4, 2024)

Intel has provided details of its Lunar Lake processor for AI-enabled PCs with chiplet tiles made by TSMC and said it is due to ship in 3Q24.
Lunar Lake is a chiplet-based processor made for Intel by foundry TSMC using its N6 and N3B manufacturing processes, nominally at 6nm and 3nm respectively. The component is then assembled by Intel using its Foveros 3D packaging technology. It is reported that the compute chiplet is made using N3B and housekeeping controller tile is made using N6.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- Ayar Labs, with Investments from AMD, Intel Capital, and NVIDIA, Secures $155 million to Address Urgent Need for Scalable, Cost-Effective AI Infrastructure
- Intel moves to chiplets for automotive AI
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
Latest News
- CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026