Materials Firms Eye India’s Semiconductor Packaging Opportunity
By Yashasvini Razdan, EETimes | September 25, 2025

Semiconductors dominated Indian headlines in early September, but the country’s ambitions rely on companies supplying the critical materials that hold these semiconductor chips together. Whether it’s wires, pastes, solders, or fluxes, global companies are eyeing the Indian market to provide these materials, which determine whether a chip can survive heat, conduct electricity reliably, and fit into advanced 2.5D/3D packaging.
While India has a strong base of local companies supplying soldering consumables for electronics assembly, the domestic production of chip-grade, ultra-fine, and high-purity materials required for advanced packaging remains limited. This leaves the industry reliant on imports and early-stage research and development (R&D) efforts.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
- KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs