Materials Firms Eye India’s Semiconductor Packaging Opportunity
By Yashasvini Razdan, EETimes | September 25, 2025

Semiconductors dominated Indian headlines in early September, but the country’s ambitions rely on companies supplying the critical materials that hold these semiconductor chips together. Whether it’s wires, pastes, solders, or fluxes, global companies are eyeing the Indian market to provide these materials, which determine whether a chip can survive heat, conduct electricity reliably, and fit into advanced 2.5D/3D packaging.
While India has a strong base of local companies supplying soldering consumables for electronics assembly, the domestic production of chip-grade, ultra-fine, and high-purity materials required for advanced packaging remains limited. This leaves the industry reliant on imports and early-stage research and development (R&D) efforts.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement
- ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
- EU funding boosts Europe's semiconductor production – VTT develops packaging methods
- Global Semiconductor IDM Qualifies Veeco Wet Processing Platform for Two New Applications in Advanced Packaging
Latest News
- Chiplet-Based FPGAs Optimize Performance for Space Applications
- Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack
- From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future
- Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
- HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem