Materials Firms Eye India’s Semiconductor Packaging Opportunity
By Yashasvini Razdan, EETimes | September 25, 2025

Semiconductors dominated Indian headlines in early September, but the country’s ambitions rely on companies supplying the critical materials that hold these semiconductor chips together. Whether it’s wires, pastes, solders, or fluxes, global companies are eyeing the Indian market to provide these materials, which determine whether a chip can survive heat, conduct electricity reliably, and fit into advanced 2.5D/3D packaging.
While India has a strong base of local companies supplying soldering consumables for electronics assembly, the domestic production of chip-grade, ultra-fine, and high-purity materials required for advanced packaging remains limited. This leaves the industry reliant on imports and early-stage research and development (R&D) efforts.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
- EU funding boosts Europe's semiconductor production – VTT develops packaging methods
- Global Semiconductor IDM Qualifies Veeco Wet Processing Platform for Two New Applications in Advanced Packaging
- Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
Latest News
- Innolux's Deployment of Key FOPLP Technologies: Leading Next-Gen Advanced Packaging and Seizing AI Opportunities
- Wiwynn, Ayar Labs, and GUC Advance Co-Packaged Optics with Live Demonstration of Integrated Optical Compute System at OCP Global Summit 2026
- ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation
- Eliyan Introduces NuLight™: World’s First 2D microVCSEL Interconnect Solution to the Copper Wall
- Evatec delivers first CLUSTERLINE® 310 for Advanced Packaging on small panel formats