Materials Firms Eye India’s Semiconductor Packaging Opportunity
By Yashasvini Razdan, EETimes | September 25, 2025

Semiconductors dominated Indian headlines in early September, but the country’s ambitions rely on companies supplying the critical materials that hold these semiconductor chips together. Whether it’s wires, pastes, solders, or fluxes, global companies are eyeing the Indian market to provide these materials, which determine whether a chip can survive heat, conduct electricity reliably, and fit into advanced 2.5D/3D packaging.
While India has a strong base of local companies supplying soldering consumables for electronics assembly, the domestic production of chip-grade, ultra-fine, and high-purity materials required for advanced packaging remains limited. This leaves the industry reliant on imports and early-stage research and development (R&D) efforts.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
- KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
- CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
Latest News
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech