First Forays Into True 3D-IC Designs

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.

By Ed Sperling, Semi Engineering | September 25th, 2025 

Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product management at Siemens EDA; Mick Posner, senior product group director for chiplet at IP solutions in Cadence‘s Compute Solutions Group; Mo Faisal of Movellus; Chris Mueth, new opportunities business manager at Keysight Technologies, and Amlendu Shekhar Choubey, senior director of product management for Synopsys‘ 3D-IC compiler platform.

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