Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
By Francoise von Trapp, 3DInCites (Dec 03, 2024)
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024 was a good place to do that. And our community members were there to lend a hand.
Many presentations offered historical overviews of advanced packaging. So wherever you are in your understanding of advanced packaging, the context was provided to catch you up to where we are today. If you missed the APC this year, you might want to check it out next year. Unfortunately, I didn’t catch the entire line-up, but here are highlights from the morning session.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Advanced packaging revenue dropped 9% in Q1 2024, but recovery is expected in 2024
- CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs