Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging

Entegris addresses critical industry need through strategic acquisition, Taiwan manufacturing investment, and partnership with Element Six

BILLERICA, Mass.-- Nov 3, 2026 --Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, today announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging.

“Growth in AI compute, from model training to inference, is intensifying power and heat-management demands in data centers,” said Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris. “We are excited to announce that Entegris is entering this fast-growing market to bring necessary innovation to meet our customers’ chip and package level materials demands.”

First, Entegris has completed its acquisition of Advanced Abrasives Corporation, a New Jersey-based specialty producer of diamond-made precision super-abrasive consumables used in hard-substrate polishing processes. The acquisition builds on Entegris’ existing SiC CMP solutions capabilities that span slurries, pads, cleans and surface conditioning, as well as on its intellectual property portfolio in materials science and surface engineering. In connection with the acquisition and following strong customer engagement, Entegris plans to invest in a new manufacturing line in Taiwan to bring these SiC solutions to market, while continuing U.S.-based exploratory research and development for next-generation thermal interface materials.

Furthermore, Entegris has entered into a long-term development partnership with Element Six, a global leader in synthetic diamond, part of De Beers Group, designed to accelerate the integration of diamond-enabled thermal management solutions into advanced packaging. The strategic collaboration will focus on scalable, cost-effective wafer-level and heterogeneous integration approaches that can reduce manufacturing complexity, minimize thermal boundary resistance and support the performance requirements of next-generation logic and memory chips and their 3-D integration.

“Thermal management is emerging as a critical industry challenge. We believe the move from conventional heat-spreading materials to novel materials and engineered thermal interfaces will mark a major shift in semiconductor manufacturing,” said Mr. Blachier. “Our goal is to facilitate better heat dissipation without compromising performance or reliability. We’re helping customers make that transition through materials innovation and integration at scale.”

At its upcoming Capital Markets Day on November 9, 2026, in New York, Entegris will present its advanced thermal management platform strategy.

ABOUT ENTEGRIS

Entegris is a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-tech industries. Entegris has approximately 9,000 employees throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service and/or research facilities in the United States, Canada, China, Germany, Israel, Japan, Malaysia, Singapore, South Korea, and Taiwan. Additional information can be found at www.entegris.com.