Commercial Chiplet Ecosystem May Be A Decade Away
By Ann Mutschler, SemiEngineering (February 29, 2024)
Technology and business hurdles must be addressed before widespread adoption.
Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product management/integrating manager at Keysight; Kevin Rinebold, account technology manager for advanced packaging solutions at Siemens EDA; and Mick Posner, vice president of product management for high-performance computing IP solutions at Synopsys. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- Arm’s Chiplet System Architecture eyes ecosystem sweet spot
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
- Chiplet Ecosystem Slowly Emerges
Latest News
- Quantum Computing Inc. Completes Acquisition of NHanced Semiconductors, Inc.
- GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
- Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
- NHanced Semiconductors President Robert Patti to Deliver Plenary Presentation on the Critical Role of Advanced Packaging at the 2026 Lithography Workshop
- Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing