Chiplets to quantum: Joe Barry on Analog’s disruptive future
By Peter Clarke, eeNews Europe (October 20, 2023)
eeNews Europe interviewed Joe Barry, vice president for systems and technology at the Cloud and Communications business unit of Analog Devices, to ask about trends in the industry and implications for his company.
The meeting took place at ADI Catalyst, Analog’s development accelerator in Limerick, Ireland. So we started by asking about the reasoning behind the formation of the center (see ADI Catalyst finds favor with Vodafone, Intel, others).
Catalyst
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- IEEE Study Achieves Efficient Integration of Quantum Dot Lasers on Silicon Chiplets
- IMAPS CHIPcon Recap – What You Need to Know About Chiplets in 2025
- Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs