Chiplets: A Technology, Not A Market
An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging.
By Geoff Tate
Semi Engineering -- March 6th, 2025
Chiplets are big business, and that business is growing. The total chiplet market today is roughly $40 billion annually.
Chiplets account for roughly 15% of TSMC’s revenues, and they account for about 25% of all DRAMs.
All of the major AI/HPC semiconductor companies (NVIDIA, AMD, Marvell, Broadcom) and the major hyper scalers (Amazon, Google, etc) are looking to chiplets to build superior solutions. And, at least so far, they remain a technology for big players.
And while some of those chiplets will be developed by smaller chipmakers for well-defined sockets, the chiplet market is not an open, plug-and-play market. The only open-market chiplet today in production volume is for HBM memory. Logic chiplets are full-custom for each high-volume application. None are UCIe-compatible.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Arteris Network-on-Chip Technology Achieves Deployment Milestone of 4 Billion Chips and Chiplets
- A methodology for turning an SoC into chiplets
- Why Chiplets Need a “Beyond IP” Management Approach
- Opportunities Unleashed by Chiplet Technology: A New Era for the Semiconductor Industry
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs